Power & Cooling for AI
10-1000kW Liquid Cooled Loadbank | Chip-Level + System-Level | GB 200/300 Compatible
Core Products
Complete liquid cooling infrastructure solutions for AI data centers, from chip-level to system-level cooling, with full power range coverage from 500W to 1000kW.
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Liquid Cooling System Architecture
Liquid Cooled Loadbank (10-1000kW)
ACS30/120kW Blind-Mate/50kW Modular, Chip-Level + System-Level, GB 200/300 Compatible
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Chip-Level Liquid Cooled Loadbank
500W-3000W per Chip, ±0.2°C Accuracy, NVIDIA A100/H100/B100 Compatible
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CDU - Cooling Distribution Unit
360kW/800kW Standard + 10kW/24kW Emergency, Response <30s, ±0.5°C Control
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PDU - Power Distribution Unit
10A-63A, SNMP/MODBUS Support, 64 Units Cascade, True RMS Measurement
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Liquid Cooled Loadbank (10-1000kW)
10-1000kW Full Range | Chip-Level + System-Level | GB 200/300 Compatible
Yoohoon Technology liquid cooled loadbank is professional test equipment designed for data center liquid cooling systems, providing ACS30 (0-30kW), 120kW blind-mate cabinet, 50kW modular and other models, accurately simulating thermal loads of GPU servers, AI accelerators, GB 200, GB 300, and NVIDIA's latest AI supernodes.
Product power range covers 10kW-1000kW, temperature control accuracy ±0.5°C (chip-level ±0.2°C), supporting water cooling, immersion, phase change cooling and other full-scenario liquid cooling solution testing, serving 100+ major internet and AI computing center customers.
- ✓Power Range: 10kW - 1000kW, ACS30/120kW/50kW Multiple Models
- ✓Temperature Accuracy: ±0.5°C (Chip-Level ±0.2°C), PID Closed-Loop Control
- ✓Compatible Scenarios: GB 200, GB 300, NVIDIA AI Supernodes
- ✓Typical Customers: Major Internet Companies and AI Computing Centers
6 Major Liquid Cooling Solutions
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